TSMC Internship Recruitment Briefing (Module Associate Engineer)

Briefing Session – Date & Venue
2022/11/24   13:00–15:00   U Building – Auditorium

Internship Information
• Internship Period: July 2023 – June 2024
• Number of Openings: 20–30 positions

Eligibility & Requirements
• Designed for fourth-year undergraduate students during the academic-year internship period (2023/7–2024/6)
• Majors in Mechanical Engineering, Electrical Engineering, Electronics, Semiconductor Engineering, or related fields
• Basic knowledge in mechanical systems required; knowledge of semiconductor processes is a plus
• Strong problem-solving ability, communication skills, teamwork, and proactive learning attitude
• Able to work in a cleanroom environment and wear cleanroom garments for most working hours
• Basic English reading and writing skills required

Job Responsibilities
• Perform maintenance and repair of semiconductor equipment for designated product lines
• Manage and improve equipment part systems, including coordination with vendors and subcontractor spare-part management
• Design maintenance jigs and improve procedures to enhance equipment stability

Benefits
• Starting salary: NT$38,000 and above
• Includes labor insurance, health insurance, and group insurance
• Opportunity for full-time employment after completion of the internship

Internship Briefing Registration

For any inquiries, please contact Ms. Bo-Hua, R&D Office, ext. 3807.